Advanced Power Electronics and Electric Machines
NLR's advanced power electronics and electric machines research delivers safe, high-performing components and systems that control the flow of electricity among energy sources, vehicles, and the grid.
Our scientists and engineers work closely with vehicle manufacturers, suppliers, universities, and other research organizations to develop lightweight, cost-effective, power-dense technologies that advance the nation's transportation and energy systems.
Research and Development
We provide the scientific building blocks needed to spur innovation through fundamental power electronics and electric machine research and engineering.
Power Electronics Packaging
Semiconductor Power Electronics Electro-Thermal Design
Electric Motor Thermal Management
Integrated Electric Traction Drive Thermal Management
Experimentation and Modeling
Our world-class facilities and equipment enable novel experimental and modeling capabilities for advanced power electronics and electric machine design, development and performance evaluation.
Learn about our power electronics and electric machines facilities.
Electric Vehicle Innovation
Advanced transportation and energy technologies rely heavily on power electronics to distribute the proper amount and type of power between components such as batteries, inverters, converters, chargers, and electric machines. Power electronics also determine the exact nature and timing of the current and voltage waveforms to the electric machine.
NLR's research works to accelerate lightweight, compact, reliable, and high-performing systems and components. These improvements can unlock lower costs, longer lifespans, and improved performance for vehicle and energy technologies.
Publications
Conference Papers
Power Electronic Development Challenges for High Power Density Integrated Electric Drive Applications, IEEE Applied Power Electronics Conference and Exposition (2026)
Experimental Results for an Inverter Integrated With A High-Speed Surface Permanent Magnet External Rotor Motor, IEEE Applied Power Electronics Conference and Exposition (2026)
Thermal Management Solution for Integrated Outer-Rotor Motor Drive: Associated Opportunities and Challenges, ASME 2025 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2026)
Thermal Management for a Novel Non-Heavy Rare-Earth Interior Permanent Magnet Machine, ASME 2025 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2026)
Reliability Analysis of SiC MOSFETs for Solid-State Circuit Breaker Application, IEEE Energy Conversion Congress and Exposition (2026)
A Symmetrical Organic Direct Bonded Copper Silicon Carbide Half Bridge Module Design With Ultra Low Loop Inductance, IEEE Energy Conversion Congress and Exposition (2026)
Enhanced Thermal Management of Outer-Rotor Electric Motors Through Additively Manufactured Heat Exchangers With End-Winding Cooling, 24th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (2026)
Predicting Thermomechanical Degradation in Bonded Interfaces Using Enhanced Image Processing and Deep Learning Techniques, Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (2026)
3D Numerical Simulation and Optimization of Wick-Free Vapor Chambers for Enhanced Thermal Management, Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (2026)
Journal Articles
The Heterogeneous Integration of Electronic Components, Nature Reviews Electrical Engineering (2026)
Spatiotemporal Learning in Power Modules: Wavelet-Enhanced Forecasting of Thermomechanical Degradation, IEEE Transactions on Components, Packaging and Manufacturing Technology (2026)
Wide-Bandgap Semiconductor Amplifiers for Fusion Plasma Heating and Control, Fusion Science and Technology (2026)
Technical Reports
Reliability Assessment of Solid-State Circuit Breakers: Cooperative Research and Development Final Report, NLR Technical Report (2026)
RePED 250 Final Report, NLR Technical Report (2026)
Two-Phase Cooling for High Packaging Density Planar Inverter: Cooperative Research and Development Final Report, NLR Technical Report (2026)
Wind 2H2 Project: Cooperative Research and Development Final Report, NLR Technical Report (2026)
Presentations
High Voltage High Power Traction Inverter Thermal Management, NLR Presentation (2026)
Thermal Management for a Novel Non-Heavy Rare-Earth Interior Permanent Magnet Machine, NLR Presentation (2026)
Thermal Management Solution for an Integrated Outer-Rotor Motor Drive: Opportunities and Challenges, NLR Presentation (2026)
2025 InterPACK: Thermal Management and Reliability Aspects, NLR Presentation (2026)
Power Electronics Module With Integrated Ceramic Heat Exchanger, NLR Presentation (2026)
Posters
High-Torque Heavy-Rare-Earth-Free Electric Motor Thermal Management, NLR Poster (2026)
Conference Papers
Parameter Degradation Monitoring and Controller Adaptation Using Digital Twin, IEEE 75th Electronic Components and Technology Conference (2025)
Thermal-Mechanical Modeling of Package Reflow for Cooling of Future CPU and GPU Devices, IEEE 75th Electronic Components and Technology Conference (2025)
Organic Direct Bonded Copper-Based Rapid Prototyping for Silicon Carbide Power Module Packaging, IEEE Applied Power Electronics Conference and Exposition (2025)
Thermal Optimization and Experimental Demonstration of a Silicon Carbide, Half-Bridge Power Module, International Microelectronics And Packaging Society Symposium (2025)
Rapid Prototyping Techniques for Organic Direct-Bonded-Copper Power Modules, Fifth International Symposium on 3D Power Electronics Integration and Manufacturing (2025)
Comparative Study of the Parasitic Capacitance of Dielectric-Liquid-Cooled Power Module Designs, Fifth International Symposium on 3D Power Electronics Integration and Manufacturing (2025)
Evaluation of Heat Spreading Technologies Within Double-Side-Cooled Power Modules, Fifth International Symposium on 3D Power Electronics Integration and Manufacturing (2025)
Organic Direct Bonded Copper-Based Rapid Prototyping for Silicon Carbide Power Module Packaging, IEEE Applied Power Electronics Conference and Exposition (2025)
Journal Articles
Foreword: Special Section on Multiphysics Aspects of Power Electronics Packaging-Power Die, Power Module, and Converter Level: Part 2, IEEE Transactions on Components, Packaging and Manufacturing Technology (2025)
Porous Mesh Manifold for Enhanced Boiling Performance, Applied Thermal Engineering (2025)
Thermal Modeling and Limitations for Power Electronics Embedded in Medium Voltage Cables, IEEE Transactions on Power Electronics (2025)
Trends and 2025 Insights on the Rise of Electric Vehicles in the USA, Nature Reviews Clean Technology (2025)
Thermal Performance of Triply Periodic Minimal Surface Lattice Structures in Single-Phase Dielectric Fluid Cooling of Power Electronics, ASME Journal of Heat and Mass Transfer (2025)
Mitigation of Boiling-Induced Thermal Degradation Using Microporous Nickel Inverse Opals Structures, ASME Journal of Electronic Packaging (2025)
Wide-Bandgap Semiconductor Amplifiers for Fusion Plasma Heating and Control, Fusion Science and Technology (2025)
Mitigation of Boiling-Induced Thermal Degradation Using Microporous Nickel Inverse Opal (NiIOs) Structures, Journal of Electronic Packaging (2025)
Technical Reports
Thermal Management for Planar Package Power Electronics: Cooperative Research and Development Final Report, NLR Technical Report (2025)
Thermal Evaluation of CCS and NACS Reference Devices and Adapters, U.S. Department of Energy Technical Report (2025)
Presentations
Organic Direct-Bonded-Copper-Based Rapid Prototyping for Silicon Carbide Power Module Packaging, NLR Presentation (2025)
Posters
An Organic, Direct Bonded Copper, Multi-Layered, Ultra-Low Inductance Package for High-Power UWBG MOSFETs, NLR Poster (2025)
Contacts
Group Manager, Advanced Power Electronics and Electric Machines
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Last Updated Sept. 1, 2026